Inside the Engineering Issue That Redefines Tomorrow’s Tech Landscape
MIT Technology Review’s latest Engineering issue arrives as a showcase of audacious projects that could reshape multiple industries. From ultra‑deep underwater tunnels to a next‑generation lithography system poised to extend Moore’s Law, and a climate‑geoengineering experiment that mimics volcanic cooling, the publication signals a decisive shift toward large‑scale, high‑impact engineering. The issue also highlights the intensifying high‑performance computing race, with China’s LineShine supercomputer now leading the benchmark charts.
Key Takeaways
- Sub‑sea tunneling breakthroughs: New design concepts and construction methods promise to connect continents beneath oceans, reducing travel time and freight costs.
- ASML’s next‑generation lithography: The forthcoming extreme ultraviolet (EUV) system is expected to push transistor scaling beyond current limits, reinforcing the semiconductor supply chain.
- Volcanic‑cooling experiment: Researchers propose a controlled aerosol injection to mimic volcanic eruptions as a rapid climate‑mitigation tool, sparking vigorous scientific debate.
- High‑performance computing rivalry: Nations are accelerating investments in exascale platforms, with performance metrics tightening and energy efficiency becoming a decisive factor.
- China’s LineShine supercomputer: Now topping global performance rankings, LineShine underscores China’s strategic emphasis on computational power for AI, scientific research, and national security.
